FPC Film-Standard Black Opaque Polyimide Composite Flexible Circuit Substrate
Product Description
Conductive Polyimide Composite Film – Low Surface Resistivity
Product Overview
GB-Type Black Polyimide Film sets itself apart by delivering a unique blend of outstanding thermal stability, electrical insulation, and dimensional reliability. The opaque black film is extensively utilized in electronics, flexible circuits, and semiconductor packaging, offering high performance while simultaneously addressing the need for critical light-blocking protection.
Product Features
This material possesses outstanding mechanical properties, an ultra-low coefficient of thermal expansion, and excellent bonding capabilities. It also meets all RoHS and REACH requirements and is certified under the UL safety standard.
Product Applications
The high-performance GL polyimide film is utilized in the production of high-precision adhesive flexible copper clad laminate (FCCL) substrates, high-stability protective overlay, semiconductor packaging, and specialized pressure-sensitive tape carriers.
Why Choose Our Factory?
- Direct Manufacturer Pricing: Eliminate intermediaries—competitive costs, flexible MOQs, and fast delivery.
- Technical Expertise: Customized anti-fog testing for your product, and support to optimize packaging performance.
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!
Product pictures
Handling & Storage Instructions
To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
- Shelf Life: 6 months from the date of manufacture.
- Storage Conditions:
- Store in a cool, dry place away from direct sunlight will be necessary.
- Avoid exposure to high humidity or extreme temperature fluctuations.
