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Brand Name : Guofeng
Model Number : 7.5um
Certification : UL ISO ROHS
Place of Origin : China
MOQ : Negotiation
Price : $300-$30000
Payment Terms : L/C,T/T
Supply Ability : Negotiation
Delivery Time : Negotiation
Packaging Details : Standard Packing
Material : Flexible Printed Circuit Film
Insulation : Excellent Insulation
Application : Electronic Devices
Durability : Long-lasting
Surface Finish : Smooth
Conductivity : Highly Conductive
Color : Transparent
Adhesion : Strong Adhesion
Flexibility : Highly Flexible
Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging Fields
GL-Type Polyimide Film delivers outstanding heat resistance, dielectric performance, and consistent dimensional integrity. Its distinctive matte black finish makes it a preferred material in consumer electronics, flex PCB applications, and semiconductor encapsulation, combining high reliability with effective optical shielding.
The GL high-performance polyimide film is primarily used in high-precision adhesive FCCL substrates, high-stability cover films, chip packaging, and special adhesive tape substrates.
Available in custom thicknesses, widths, and finishes (matte, glossy, metallic), our Polyimide film ensures consistent quality, fast production, and competitive pricing for bulk orders. Contact us today for free samples & wholesale deals!


To ensure the longevity and performance of our Polyimide film, please adhere to the following guidelines:
· Store in a cool, dry place away from direct sunlight will be necessary.
· Avoid exposure to high humidity or extreme temperature fluctuations.
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Polyimide Core Film for Flexible Printed Circuits & Semiconductor Packaging Fields Images |